MPC8555VTAPF datasheet(75/88 Pages) FREESCALE

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MPC8555VTAPF 数据表(PDF) 75 Page - Freescale Semiconductor, Inc

部件名	MPC8555VTAPF

功能描述	PowerQUICC??III Integrated Communications Processor Hardware Specifications

PDF	88 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

标志

75 / 88 page

MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Thermal

The spring mounting should be designed to apply the force only directly above the die. By localizing the

force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to

the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the

opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the

package. Figure 47 and provide exploded views of the plastic fence, heat sink, and spring clip.

Figure 47. Exploded Views (1) of a Heat Sink Attachment using a Plastic Fence

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