1997 Nov 04

14

Philips Semiconductors

Product specification

IC card interface

TDA8002

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); note 1.

Note

1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional

operation of the device under this condition is not implied.

HANDLING

Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.

Method 3015 (HBM 1500

Ω, 100 pF) 3 positive pulses and 3 negative pulses on each pin referenced to ground.

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

−0.3

+6.5

V

voltage on CMOS pins

XTAL1, XTAL2, ALARM, ALARM,

MODE, RSTIN, CLKSEL, AUX2UC,

AUX1UC, CLKDIV1, CLKDIV2,

CLKOUT, STROBE, CMDVCC and

OFF

−0.3

+6.5

V

voltage on card contact pins

I/O, AUX2, PRES, PRES, AUX1,

−0.3

+6.5

V

electrostatic handling

AUX2, PRES and PRES

−6+6

kV

on all other pins

−2+2

kV

storage temperature

−55

+125

°C

continuous total power dissipation

TDA8002T

−

0.56

W

TDA8002G

−

0.46

W

operating ambient temperature

−25

+85

°C

junction temperature

−

150

°C

SYMBOL

PARAMETER

VALUE

UNIT

thermal resistance from junction to ambient in free air

SOT136-1

70

K/W

SOT401-1

91

K/W