24AA52/24LCS52

DS21166J-page 20

© 2005 Microchip Technology Inc.

8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

L

E2

A3

A1

A

TOP VIEW

D

E

EXPOSED

PAD

METAL

D2

BOTTOM VIEW

2

1

bp

n

(NOTE 3)

EXPOSED

TIE BAR

PIN 1

(NOTE 1)

ID INDEX

AREA

(NOTE 2)

CONFIGURATION

CONTACT

ALTERNATE

DETAIL

K

3. Package may have one or more exposed tie bars at ends.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

JEDEC Equivalent MO-229 VCED-2

See ASME Y14.5M

See ASME Y14.5M

MILLIMETERS*

0.50 BSC

2.00 BSC

0.20 REF.

3.00 BSC

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

.039

.035

.031

0.80

A

Overall Height

2. Exposed pad may vary according to die attach paddle size.

* Controlling Parameter

Contact Length §

Notes:

Contact Width

Standoff

Overall Width

Overall Length

Contact Thickness

Exposed Pad Width

Exposed Pad Length

.010

.008

L

b

.012

0.20

.001

.008 REF.

.079 BSC

–

–

.118 BSC

D

.051

.059

D2

E2

E

.000

A3

A1

.069

.075

1.30**

1.50**

.002

0.00

Dimension Limits

Pitch

Number of Pins

INCHES

.020 BSC

MIN

n

e

NOM

Units

8

MAX

MIN

1.00

0.90

0.25

0.30

–

–

1.75

1.90

0.02

0.05

8

NOM

MAX

Contact-to-Exposed Pad

§

.012

K

.016

0.40

.020

0.30

0.50

** Not within JEDEC parameters

§ Significant Characteristic

.008

–

–

0.20

–

–

DWG No. C04-123

Revised 09-12-05