MCP2510-SLASHST datasheet(62/80 Pages) MICROCHIP

62 / 80 page

MCP2510

DS21291F-page 62

TABLE 12-1:

DC CHARACTERISTICS

DC Characteristics

Industrial (I):

TAMB = -40°C to +85°C

VDD = 3.0V to 5.5V

Extended (E):

TAMB = -40°C to +125°C

VDD = 4.5V to 5.5V

Param.

No.

Sym

Characteristic

Min

Max

Units

Conditions

VDD

Supply Voltage

3.0

5.5

VRET

2.4

—

High Level Input Voltage

Note

VIH

RXCAN

VDD+1

SCK, CS, SI, TXnRTS Pins

.7 VDD

VDD+1

OSC1

.85 VDD

VDD

RESET

.85 VDD

VDD

Low Level Input Voltage

Note

VIL

RXCAN,TXnRTS Pins

-0.3

.15 VDD

SCK, CS, SI

-0.3

0.4

OSC1

VSS

.3 VDD

RESET

VSS

.15 VDD

Low Level Output Voltage

VOL

TXCAN

—

0.6

IOL = -6.0 mA, VDD = 4.5V

RXnBF Pins

—

0.6

IOL = -8.5 mA, VDD = 4.5V

SO, CLKOUT

—

0.6

IOL = -2.1 mA, VDD = 4.5V

INT

—0.6

IOL = -1.6 mA, VDD = 4.5V

High Level Output Voltage

VOH

TXCAN, RXnBF Pins

VDD -0.7

—

IOH = 3.0 mA, VDD = 4.5V, I temp

SO, CLKOUT

VDD -0.5

—

IOH = 400 µA, VDD = 4.5V

INT

VDD -0.7

—

IOH = 1.0 mA, VDD = 4.5V

Input Leakage Current

ILI

All I/O except OSC1 and

TXnRTS pins

-1

µA

CS = RESET = VDD,

VIN = VSS to VDD

OSC1 Pin

-5

µA

CINT

Internal Capacitance

(All Inputs And Outputs)

—7

TAMB = 25°C, fC = 1.0 MHz,

VDD = 5.0V (Note)

IDD

Operating Current

—

VDD = 5.5V, FOSC = 25 MHz,

FCLK = 1 MHz, SO = Open

IDDS

Standby Current (Sleep Mode)

—

µA

CS, TXnRTS = VDD, Inputs tied to

VDD or VSS

Note:

This parameter is periodically sampled and not 100% tested.

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