TC500/A/510/514

DS21428D-page 24

© 2006 Microchip Technology Inc.

24-Lead Skinny Plastic Dual In-line (PF) – 300 mil (PDIP)

A2

2

1

D

n

E1

c

eB

E

β

α

p

L

B

B1

A

A1

15

10

5

15

10

5

β

Mold Draft Angle Bottom

15

10

5

15

10

5

α

Mold Draft Angle Top

10.92

9.40

7.87

.430

.370

.310

eB

Overall Row Spacing

0.56

0.46

0.36

.022

.018

.014

B

Lower Lead Width

1.52

1.33

1.14

.060

.053

.045

B1

Upper Lead Width

0.38

0.29

0.20

.015

.012

.008

c

Lead Thickness

3.30

3.18

3.05

.130

.125

.120

L

Tip to Seating Plane

31.88

31.75

31.62

1.255

1.250

1.245

D

Overall Length

6.60

6.35

6.10

.260

.250

.240

E1

Molded Package Width

8.26

7.87

7.49

.325

.310

.295

E

Shoulder to Shoulder Width

0.38

.015

A1

Base to Seating Plane

3.68

3.30

2.92

.145

.130

.115

A2

Molded Package Thickness

4.06

3.81

3.56

.160

.150

.140

A

Top to Seating Plane

2.54

.100

p

Pitch

24

24

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

Notes:

JEDEC Equivalent: MS-001 AF

Drawing No. C04-043

* Controlling Parameter

Revised 09-14-05