© 2006 Microchip Technology Inc.

DS21428D-page 25

TC500/A/510/514

24-Lead Plastic Small Outline (OG) – Wide, 300 mil (SOIC)

2

1

D

e

n

B

E

E1

L

c

β

h

φ

A2

α

A

A1

h

Foot Angle

φ

0°

8°

0°

8°

15°

5°

15°

5°

β

Mold Draft Angle Bottom

15°

5°

15°

5°

α

Mold Draft Angle Top

0.51

0.31

.020

.012

B

Lead Width

0.33

0.20

.013

.008

c

Lead Thickness

1.27

0.40

.050

.016

L

Foot Length

0.75

0.25

.030

.010

h

Chamfer Distance

15.40 BSC

.607 BSC

D

Overall Length

7.50 BSC

.295 BSC

E1

Molded Package Width

10.30 BSC

.406 BSC

E

Overall Width

0.30

0.10

.012

.004

A1

Standoff

2.55

2.05

.100

.081

A2

Molded Package Thickness

2.65

2.35

.104

.093

A

Overall Height

1.27 BSC

.050 BSC

e

Pitch

24

24

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

Notes:

JEDEC Equivalent: MS-013 AD

Revised 07-19-05

* Controlling Parameter per JEDEC MS-103 Revision C.

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BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

Drawing No. C04-025