TC500/A/510/514

DS21428D-page 26

© 2006 Microchip Technology Inc.

28-Lead Skinny Plastic Dual In-line (PJ) – 300 mil (PDIP)

15

10

5

15

10

5

β

Mold Draft Angle Bottom

15

10

5

15

10

5

α

Mold Draft Angle Top

10.92

8.89

8.13

.430

.350

.320

eB

Overall Row Spacing

§

0.56

0.48

0.41

.022

.019

.016

B

Lower Lead Width

1.65

1.33

1.02

.065

.053

.040

B1

Upper Lead Width

0.38

0.29

0.20

.015

.012

.008

c

Lead Thickness

3.43

3.30

3.18

.135

.130

.125

L

Tip to Seating Plane

35.18

34.67

34.16

1.385

1.365

1.345

D

Overall Length

7.49

7.24

6.99

.295

.285

.275

E1

Molded Package Width

8.26

7.87

7.62

.325

.310

.300

E

Shoulder to Shoulder Width

0.38

.015

A1

Base to Seating Plane

3.43

3.30

3.18

.135

.130

.125

A2

Molded Package Thickness

4.06

3.81

3.56

.160

.150

.140

A

Top to Seating Plane

2.54

.100

p

Pitch

28

28

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

2

1

D

n

E1

c

eB

β

E

α

p

L

A2

B

B1

A

A1

Notes:

JEDEC Equivalent: MO-095

Drawing No. C04-070

* Controlling Parameter

Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.

§ Significant Characteristic