MCP23008-ESLASHP datasheet(33/44 Pages) MICROCHIP

33 / 44 page

DS21919D-page 33

MCP23008/MCP23S08

3.0

PACKAGING INFORMATION

3.1

Package Marking Information

18-Lead PDIP (300 mil)

18-Lead SOIC (300 mil)

20-Lead SSOP

XXXXXXXXXXXX

YYWWNNN

XXXXXXXXXXXXXXXXX

YYWWNNN

Example:

MCP23008

0634256

MCP23008-E/P^^

0634256

XXXXXXXXXXXX

YYWWNNN

MCP23S08

XXXXXXXXXXXX

0634256

E/SO^^

E/SS^^

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

20-Lead QFN

Example

XXXXX

XXXXXX

YWWNNN

23S08

E/ML^^

0637

256

MCP23008-E/P 数据表(PDF) 33 Page - Microchip Technology

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