© 2007 Microchip Technology Inc.

DS21919D-page 41

MCP23008/MCP23S08

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

.

Device

MCP23008:

MCP23008T:

(Tape and Reel)

MCP23S08:

8-Bit I/O Expander w/ SPI Interface

MCP23S08T:

8-Bit I/O Expander w/ SPI Interface

(Tape and Reel)

Temperature

Range

E=

-40

°C to +125°C (Extended) *

* While these devices are only offered in the “E”

temperature range, the device will operate at different

voltages and temperatures as identified in the

Section 2.0 “Electrical Characteristics”.

Package

ML

=

Plastic Quad Flat, No Lead Package

4x4x0.9 mm Body (QFN), 20-Lead

P

=

Plastic DIP (300 mil Body), 18-Lead

SO

=

Plastic SOIC (300 mil Body), 18-Lead

SS

=

SSOP, (209 mil Body, 5.30 mm), 20-Lead

PART NO.

X

/XX

Package

Temperature

Range

Device

Examples:

a)

MCP23008-E/P:

Extended Temp.,

18LD PDIP package.

b)

MCP23008-E/SO: Extended Temp.,

18LD SOIC package.

c)

MCP23008T-E/SO: Tape and Reel,

Extended Temp.,

18LD SOIC package.

d)

MCP23008-E/SS:

Extended Temp.,

20LD SSOP package.

e)

MCP23008T-E/SS: Tape and Reel,

Extended Temp.,

20LD SSOP package.

f)

MCP23008-E/ML: Extended Temp.,

20LD QFN package.

a)

MCP23S08-E/P:

Extended Temp.,

18LD PDIP package.

b)

MCP23S08-E/SO: Extended Temp.,

18LD SOIC package.

c)

MCP23S08T-E/SO: Tape and Reel,

Extended Temp.,

18LD SOIC package.

d)

MCP23S08-E/SS: Extended Temp.,

20LD SSOP package.

e)

MCP23S08T-E/SS: Tape and Reel,

Extended Temp.,

20LD SSOP package.

f)

MCP23S08T-E/MF: Tape and Reel,

Extended Temp.,

20LD QFN package.

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