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MCP23008-E/P 数据表(PDF) 36 Page - Microchip Technology

部件名 MCP23008-E/P
功能描述  8-Bit I/O Expander with Serial Interface
PDF  44 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

MCP23008-E/P 数据表(HTML) 36 Page - Microchip Technology

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MCP23008/MCP23S08
DS21919D-page 36
© 2007 Microchip Technology Inc.
16-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
16
Pitch
e
0.65 BSC
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Width
E
4.00 BSC
Exposed Pad Width
E2
2.50
2.65
2.80
Overall Length
D
4.00 BSC
Exposed Pad Length
D2
2.50
2.65
2.80
Contact Width
b
0.25
0.30
0.35
Contact Length
L
0.30
0.40
0.50
Contact-to-Exposed Pad
K
0.20
–
–
D
E
N
2
1
EXPOSED
PAD
D2
E2
2
1
e
b
K
N
NOTE 1
A3
A1
A
L
TOP VIEW
BOTTOM VIEW
Microchip Technology Drawing C04-127B



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