Data Sheet

ADA4870

ABSOLUTE MAXIMUM RATINGS

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Rev. B | 6 of 24

Table 3.

Parameter

Rating

Supply Voltage

42 V

Power Dissipation

See the Power Dissipation section

and the Safe Operating Area sec-

tion

Common-Mode Input Voltage Range

VEE to VCC

Differential Input Voltage Range

±0.7 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the package is limited

by the associated rise in junction temperature (TJ) on the die. At

approximately 150°C, which is the glass transition temperature, the

plastic changes its properties. Exceeding a junction temperature of

150°C can result in changes in the silicon devices, potentially caus-

ing failure. Table 4 shows the junction to case thermal resistance

(θJC) for the LFCSP package. For more detailed information on

power dissipation and thermal management, see the Applications

Information section.

Table 4. Thermal Resistance

Package Type

θJC

Unit

48-Lead LFCSP

1.3

°C/W

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.