Data Sheet

ADA4932-1/ADA4932-2

ABSOLUTE MAXIMUM RATINGS

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Rev. F | 7 of 27

Table 7.

Parameter

Rating

Supply Voltage

11 V

Power Dissipation

See Figure 3

Input Current, +IN, −IN, PD

±5 mA

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

ADA4932-1

−40°C to +105°C

ADA4932-2

−40°C to +105°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

θJA is specified for the device (including exposed pad) soldered

to a high thermal conductivity 2s2p circuit board, as described in

EIA/JESD 51-7.

Table 8. Thermal Resistance

Package Type

θJA

Unit

ADA4932-1, 16-Lead LFCSP (Exposed Pad)

91

°C/W

ADA4932-2, 24-Lead LFCSP (Exposed Pad)

65

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4932-1/

ADA4932-2 package is limited by the associated rise in junction

temperature (TJ) on the die. At approximately 150°C, which is the

glass transition temperature, the plastic changes its properties.

Even temporarily exceeding this temperature limit can change

the stresses that the package exerts on the die, permanently

shifting the parametric performance of the ADA4932-1/ADA4932-2.

Exceeding a junction temperature of 150°C for an extended period

can result in changes in the silicon devices, potentially causing

failure.

The power dissipated in the package (PD) is the sum of the quies-

cent power dissipation and the power dissipated in the package

due to the load drive. The quiescent power is the voltage between

the supply pins (VS) times the quiescent current (IS). The power

dissipated due to the load drive depends upon the particular appli-

cation. The power due to load drive is calculated by multiplying the

load current by the associated voltage drop across the device. RMS

voltages and currents must be used in these calculations.

Airflow increases heat dissipation, effectively reducing θJA. In addi-

tion, more metal directly in contact with the package leads/ exposed

pad from metal traces, through holes, ground, and power planes

reduces θJA.

Figure 3 shows the maximum safe power dissipation in the package

vs. the ambient temperature for the single 16-lead LFCSP (91°C/W)

and the dual 24-lead LFCSP (65°C/W) on a JEDEC standard

4-layer board with the exposed pad soldered to a PCB pad that is

connected to a solid plane.

Figure 3. Maximum Power Dissipation vs. Ambient Temperature for a 4-Layer

Board

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.