AD8099

Data Sheet

Rev. E | Page 24 of 26

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-012-A A

1.27

0.40

1.75

1.35

2.29

2.29

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

0.25

0.17

8°

0°

0.50

0.25

45°

COPLANARITY

0.10

1.04 REF

8

1

4

5

1.27 BSC

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

BOTTOM VIEW

TOP VIEW

0.51

0.31

1.65

1.25

Figure 77. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]

Narrow Body

(RD-8-1)

Dimensions shown in millimeters

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

PIN 1

INDICATOR

(R 0.15)

Figure 78. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

Ordering Quantity

AD8099ARDZ

−40°C to +125°C

8-Lead SOIC_N_EP

RD-8-1

98

AD8099ARDZ-REEL

−40°C to +125°C

8-Lead SOIC_N_EP

RD-8-1

2,500

AD8099ARDZ-REEL7

−40°C to +125°C

8-Lead SOIC_N_EP

RD-8-1

1,000

AD8099ACPZ-R2

−40°C to +125°C

8-Lead LFCSP

CP-8-13

HDB

250

AD8099ACPZ-REEL

−40°C to +125°C

8-Lead LFCSP

CP-8-13

HDB

5,000

AD8099ACPZ-REEL7

−40°C to +125°C

8-Lead LFCSP

CP-8-13

HDB

1,500

1 Z = RoHS Compliant Part.