AD8657/AD8659

Data Sheet

Rev. C | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

20.5 V

Input Voltage

(V−) − 300 mV to (V+) + 300 mV

Input Current1

±10 mA

Differential Input Voltage

±VSY

Output Short-Circuit

Duration to GND

Indefinite

Temperature Ranges

Storage

−65°C to +150°C

Operating

−40°C to +125°C

Junction

−65°C to +150°C

Lead Temperature

(Soldering, 60 sec)

300°C

1

The input pins have clamp diodes to the power supply pins. Limit the input

current to 10 mA or less whenever input signals exceed the power supply

rail by 0.3 V.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages using a

standard 4-layer JEDEC board. The exposed pad (LFCSP

packages only) is soldered to the board.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

8-Lead MSOP (RM-8)

142

45

°C/W

8-Lead LFCSP (CP-8-11)

75

12

°C/W

14-Lead SOIC (R-14)

115

36

°C/W

16-Lead LFCSP (CP-16-20)

52

13

°C/W

ESD CAUTION