DS782F1

39

CS4349

11.PACKAGE DIMENSIONS

1. D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold

mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per

side.

2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be

0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-

duce dimension “b” by more than 0.07 mm at least material condition.

3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.

THERMAL CHARACTERISTICS

INCHES

MILLIMETERS

NOTE

DIM

MIN

NOM

MAX

MIN

NOM

MAX

A

--

--

0.043

--

--

1.10

A1

0.002

0.004

0.006

0.05

--

0.15

A2

0.03346

0.0354

0.037

0.85

0.90

0.95

b

0.00748

0.0096

0.012

0.19

0.245

0.30

2,3

D

0.303

0.307

0.311

7.70

7.80

7.90

1

E

0.248

0.2519

0.256

6.30

6.40

6.50

E1

0.169

0.1732

0.177

4.30

4.40

4.50

1

e

--

0.026 BSC

--

--

0.65 BSC

--

L

0.020

0.024

0.028

0.50

0.60

0.70

µ

0°4°

8°0°4°

8°

JEDEC #: MO-153

Controlling Dimension is Millimeters.

Parameters

Symbol

Min

Typ

Max

Units

Package Thermal Resistance

Single-Layer PCB

Multi-Layer PCB

-

70

105

-°C/Watt

24L TSSOP (4.4 mm BODY) PACKAGE DRAWING

E

N

1 23

e

A1

A2

A

D

SEATING

PLANE

L

SIDE VIEW

END VIEW

TOP VIEW

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