Data Sheet

ADL8111

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 5 of 24

Table 5.

Parameter

Rating

VDD_PA

+7 V dc

VDD_SW Range

−0.3 V to +3.7 V

VSS_SW Range

−3.7 V to +0.3 V

Control Voltage (VA, VB) Range

−0.3 V to VDD + 0.3 V

RF Input Power (RFIN) − Internal Amplifier State

20 dBm

RFIN − Internal Bypass,

31 dBm

External Bypass A, External Bypass B

RFIN (IN_A, OUT_A, IN_B, and OUT_B) Termination

Path (VDD_SW, VA, VB = 3.3 V, VSS = −3.3 V, TA =

85°C, and Frequency = 2 GHz)

28 dBm

Hot Switch Power Level (IN_A, OUT_A, IN_B, and

OUT_B), VDD_SW = 3.3 V, TA = 85°C,

30 dBm

and Frequency = 2 GHz

Hot Switch Power Level (Internal Amplifier State)

20 dBm

Continuous Power Dissipation, PDISS (TA = 85°C, Derate

6.8 mW/°C Above 85°C)

0.61 W

Channel Temperature

175°C

Maximum Peak Reflow Temperature (Moisture Sensitivity

Level 3, MSL3)1

260°C

Storage Temperature Range

−40°C to +125°C

Operating Temperature Range

−40°C to +85°C

ESD Sensitivity (Human Body Model)

Class 1B

(Passed ±750 V)

1 See the Ordering Guide section for additional information.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to the printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case thermal resistance.

Table 6. Thermal Resistance

Package Type

θJC

Unit

CC-28-31

148

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel through the

ground paddle to the PCB, and the ground paddle is held constant at an 85°C

operating temperature.

POWER DERATING CURVES

Figure 2. Power Derating for RFIN Port

Figure 3. Power Derating for Terminated Path

Figure 4. Power Derating for Hot Switching Power

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.