PCA9502_3

© NXP B.V. 2006. All rights reserved.

Product data sheet

Rev. 03 — 13 October 2006

19 of 25

NXP Semiconductors

PCA9502

14. Package outline

Fig 19. Package outline SOT616-3 (HVQFN24)

0.5

1

0.2

A1

Eh

b

UNIT

y

e

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

4.1

3.9

Dh

2.75

2.45

y1

4.1

3.9

2.75

2.45

e1

2.5

e2

2.5

0.30

0.18

c

0.05

0.00

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT616-3

MO-220

04-11-19

05-03-10

- - -

- - -

0.5

0.3

L

0.1

v

0.05

w

0

2.5

5 mm

scale

SOT616-3

HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;

24 terminals; body 4 x 4 x 0.85 mm

max.

A

A1

c

detail X

y

y1 C

e

L

Eh

Dh

e

e1

b

712

24

19

18

13

6

1

X

D

E

C

B

A

e2

terminal 1

index area

terminal 1

index area

A

C

C

B

1/2

e

1/2

e

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.