MITSUBISHI SEMICONDUCTOR <Single-In-Line Package Intelligent Power Module>

PS21661-RZ/FR

TRANSFER-MOLD TYPE

INSULATED TYPE

Mar. 2004

Fig. 2 PS21661-FR PACKAGE OUTLINES

Dimensions in mm

V

V

V

V

mA

V

20

20

10

Control supply voltage

Control supply voltage

Input voltage

Fault output supply voltage

Fault output current

Current sensing input voltage

450

500

600

3

6

13.8

–20~+150

Applied between P-N

Applied between P-N

°C

°C, tw ≤ 1msec

°C, per 1 chip

(Note 1)

Condition

Symbol

Parameter

Ratings

Unit

Supply voltage

Supply voltage (surge)

Collector-emitter voltage

Collector current

Collector current (peak)

Collector dissipation

Junction temperature

V

V

V

A

A

W

°C

°C, unless otherwise noted)

INVERTER PART

Condition

Symbol

Parameter

Ratings

Unit

CONTROL (PROTECTION) PART

Note 1 : The maximum junction temperature rating of the power chips integrated within the SIP-IPM is 150

q~#5 : pins numbers. The terminals array, please reference

to the Fig.7.