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ADP1763 数据表(PDF) 11 Page - Analog Devices |
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ADP1763 数据表(HTML) 11 Page - Analog Devices |
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11 / 62 page ![]() Data Sheet LT3074 analog.com Rev 0. 11 of 62 Thermal Resistance Thermal performance is directly linked to PCB design and operating environment. Close attention to PCB thermal design is required. Table 3. Thermal Resistance PACKAGE TYPE 1 θJA θJCTOP θJCBOT UNIT 22-LEAD 3mm × 4mm LQFN 33 47 3.5 °C/W 1 θ values are determined per JESD51. θJA value is obtained with demo board. Electrostatic Discharge (ESD) The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only Human body model (HBM) per ANSI/ESDA/JEDEC JS-001 Charged device model (CDM) per ANSI/ESDA/JEDEC JS- 002. ESD Ratings Table 4. LT3074, 22-Lead 3mm X 4mm LQFN ESD Model Withstand Threshold (V) Class HBM 3500 2 CDM 1250 C5 ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high-energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. |
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