data sheet

CQFP

Features:

CERAMIC

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Ceramic Quad Flat Pack

Package (CQFP)

Amkor Technology is continuing to service this

established industry package. The Amkor

Technology CQFP capability provides you, the

customer, with a wide range of lead counts and

body sizes available from various suppliers. The

CQFP is a hermetic package consisting of two

pieces of dry pressed ceramic surrounding a

"gullwing" formed leadframe. The ceramic / LF /

ceramic system is held together hermetically by

glass. The frit lid is sealed/reflowed over the

package cavity at temperatures between

400° - 460° Centigrade.

Applications:

Along with the other standard industry packages,

the CQFP has a proven track record and is still

being used by semiconductor technologies such as:

Digital to Analog converters, Microwave, Logic,

Memory, Microcontrollers, and Video controllers.

Some end applications are: Military electronics,

Commercial electronics, Automotive and

Telecommunications.

The CQFP offers a variety of features:

• Square package body

• 14-256 lead count, 25-50 mil lead pitch's

• Hermetic package

• High thermal conductive ceramic

• Solder Plate lead finish

• JEDEC standard compliant

• Wide selection of available cavity sizes to

meet most die size needs

• Commercial or full Military flows

DS806

Rev Date: 08’02

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