Reliability Qualification

Amkor package qualification uses three independent

production lots and a minimum of 77 units per

test group. All testing includes JSTD-020 moisture

preconditioning.

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Moisture sensitivity characterization: JEDEC level 3,

30°C/60% RH, 192 hours

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uHAST: 130°C/85% RH, no bias, 96 hours

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Temp cycle: -65°C/+150°C, 500 cycles

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High temp storage: 150°C, 1000 hours

Services And Support

Amkor has a broad base of resources available to help

customers bring quality products to market quickly and

at the lowest possible cost.

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Full package characterization

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Thermal, mechanical stress and electrical

performance modeling

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Turnkey assembly, test and drop ship

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World-class reliability testing and failure analysis

ePad TSSOP/MSOP/SOIC/SSOP

Cross Section ePad TSSOP

Cross Section ePad SOIC

Test Services

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Program generation/conversion

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Wafer probe

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Burn-in capabilities

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-55°C to +165°C test available

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Strip test available

Shipping

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Clear anti-static tube, 20 inch

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Tape and reel

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Dry pack

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Drop ship

Wirebond

Die attach adhesive

Die

Exposed pad

A

B

Mold compound

Ground bond

Cu leadframe

C

E

F

D

G

Wirebond

Die attach adhesive

Die

A

B

Exposed pad

Mold compound

Cu leadframe

C

D

E

F

A

E

B

F

D

C

A

E

B

G

F

D

C