ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe

based, plastic encapsulated packages that are well suited for

applications requiring optimum thermal performance, compressed

body size and tightened lead pitch. These industry standard IC

packages offer a substantial increase in heat dissipation, yield a

significant reduction in size and provide value-added, low-cost

solutions for a wide range of applications. A green BOM is standard,

allowing devices to meet applicable Pb-free and RoHS standards.

ExposedPad TSSOP/

MSOP/SOIC/SSOP

DATA SHEET | LEADFRAME PRODUCTS

Thermal Performance

Forced Convection, Single-Layer PCB

Package

Body Size

(mm)

Pad Size

(mm)

θJA at (°C/W) by Velocity (LFPM)

0

200

500

TSSOP 16 Ld*

4.4 x 5.0

3.0 x 3.0

37.6

32.3

30.2

TSSOP 20 Ld*

4.4 x 6.5

3.0 x 4.2

37.6

32.3

29.9

TSSOP 28 Ld*

4.4 x 9.7

3.0 x 5.5

37.6

32.0

29.0

MSOP 10 Ld*

3.0 x 3.0

1.73 x 2.39

38.0

33.0

31.0

SOIC 8 Ld

3.9 x 4.9

2.3 x 2.3

58.6

52.1

49.4

*Estimated

JEDEC standard test boards

Electrical Performance

Simulated Results @ 100 MHz

Package

Body Size

(mm)

Pad Size

(mm)

Center

Inductance

(nH)

Corner

Resistance

(mF)

TSSOP 16 Ld*

4.4 x 5.0

3.0 x 3.0

1.58

2.28

TSSOP 16 Ld*

4.4 x 6.5

3.0 x 4.2

1.68

2.45

TSSOP 16 Ld*

4.4 x 9.7

3.0 x 5.5

1.70

2.65

TSSOP 16 Ld*

6.1 x 14

4.7 x 5.5

1.90

2.85

MSOP 8 Ld*

3.0 x 3.0

1.73 x 2.39

1.50

2.20

*Estimated

FEATURES

f

Cu wire interconnect for low cost

f

Standard JEDEC package outlines

f

Multi-die production capability

f

Turnkey test services, including strip

test options

f

ExposedPad configuration for

increased thermal efficiency

f

Up to 60% improvement in Theta

JA (compared to standard TSSOP or

SOIC)

f

Green materials are standard –

Pb-free and RoHS compliant

f

Stealth dicing (narrow saw streets)

f

Larger/Higher density leadframe strips

f

Leadframe roughening for improved

MSL capability

PROCESS HIGHLIGHTS

f

PCC wire is standard, Au and Ag wire

available

f

Wafer backgrinding services available

f

Multiple die and die stacking capability

f

NiPdAu (PPF) or matte Sn lead finish

options

f

Laser mark on package body