TSSOP 数据表(PDF) - Amkor Technology

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TSSOP 数据表 (PDF) - Amkor Technology

TSSOP Datasheet PDF - Amkor Technology


部件名	TSSOP

下载	TSSOP 下载

文件大小	502.24 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

TSSOP Datasheet (PDF)

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下载数据表

TSSOP Datasheet PDF - Amkor Technology


部件名	TSSOP

下载	TSSOP Click to download

文件大小	502.24 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

TSSOP 数据表 (HTML) - Amkor Technology

TSSOP Datasheet HTML 1Page - Amkor Technology

TSSOP Datasheet HTML 2Page - Amkor Technology

TSSOP 产品详情

FEATURES
Cu wire interconnect for lowest cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
Available in ExposedPad configuration (Ref: DS571)
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability

类似零件编号 - TSSOP

制造商	部件名	数据表	功能描述
Amkor Technology	TSSOP	780Kb / 3P	ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based 12/21
Amkor Technology	TSSOP	411Kb / 2P	Silver Wirebonding 02/22
TT Electronics.	TSSOP	562Kb / 4P	Surface Mount TSSOP Resistor Networks 08.21
Diodes Incorporated	TSSOP-14	188Kb / 14P	SUGGESTED PAD LAYOUT Rev 43
Diodes Incorporated	TSSOP-14	404Kb / 27P	SUGGESTED PAD LAYOUT Rev 52

类似说明 - TSSOP

制造商	部件名	数据表	功能描述
STMicroelectronics	SSOP24	59Kb / 4P	24-LEAD SHRINK SMALL OUTLINE PACKAGE Nov-2002
National Semiconductor ...	MTD48	62Kb / 1P	48 Lead Molded Thin Shrink Small Outline Package, JEDEC
Intersil Corporation	M24.173B	42Kb / 1P	Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP)
fujitsu semiconductor	FPT-20P-M04	37Kb / 1P	THIN SHRINK SMALL OUTLINE PACKAGE
Amkor Technology	CSSOP	304Kb / 1P	Ceramic Shrink Small Outline Package
ACCUTEK MICROCIRCUIT CO...	AK08D300	68Kb / 2P	Micro Small Outline Package MSOP DIP Adapters
Advanced Power Electron...	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
Advanced Power Electron...	AP2318AGEN-HF	64Kb / 4P	Small Outline Package
Amkor Technology	SSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
Guangdong Youtai Semico...	LM75B	312Kb / 23P	plastic thin shrink small outline package; 8 leads;

关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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