| 制造商 | 部件名 | 数据表 | 功能描述 |
 STMicroelectronics |
SSOP24
|
59Kb / 4P |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
Nov-2002 |
 National Semiconductor ... |
MTD48
|
62Kb / 1P |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC
|
 Intersil Corporation |
M24.173B
|
42Kb / 1P |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP)
|
 fujitsu semiconductor |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
 Amkor Technology |
CSSOP
|
304Kb / 1P |
Ceramic Shrink Small Outline Package
|
 ACCUTEK MICROCIRCUIT CO... |
AK08D300
|
68Kb / 2P |
Micro Small Outline Package MSOP DIP Adapters
|
 Advanced Power Electron... |
AP2306AGEN-HF
|
101Kb / 4P |
Small Outline Package
|
|
AP2318AGEN-HF
|
64Kb / 4P |
Small Outline Package
|
 Amkor Technology |
SSOP
|
433Kb / 2P |
Shrink Small Outline, Quarter-Size Small-Outline Packages
|
 Guangdong Youtai Semico... |
LM75B
|
312Kb / 23P |
plastic thin shrink small outline package; 8 leads;
|