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TSSOP 数据表 (PDF) - Amkor Technology

TSSOP Datasheet PDF - Amkor Technology
部件名 TSSOP
下载  TSSOP 下载
文件大小   780.44 Kbytes
  3 Pages
制造商  AMKOR [Amkor Technology]
网页  http://www.amkor.com
标志 AMKOR - Amkor Technology
功能描述 ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

TSSOP Datasheet (PDF)

Go To PDF Page 下载 数据表
TSSOP Datasheet PDF - Amkor Technology

部件名 TSSOP
下载  TSSOP Click to download

文件大小   780.44 Kbytes
  3 Pages
制造商  AMKOR [Amkor Technology]
网页  http://www.amkor.com
标志 AMKOR - Amkor Technology
功能描述 ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

TSSOP 数据表 (HTML) - Amkor Technology


TSSOP 产品详情

FEATURES
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
ExposedPad configuration for increased thermal efficiency
Up to 60% improvement in Theta JA (compared to standard TSSOP or SOIC)
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability




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类似说明 - TSSOP

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关于 Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。




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