MicroLeadFrame®

Features

f

Small size (reduce package footprint by 50% or more

and improved RF performance) and weight

f

Standard leadframe process flow and equipment

f

Excellent thermal and electrical performance

f

0.35 mm to 1.45 mm maximum height

f

I/O count range: 1-180 available with conventional

MLF®; >200 possible with rtMLF®

f

1-13 mm body size

f

Thin profile and superior die-to-body size ratio

f

Pb-free/Green

f

Flexible designs and high yields

f

Saw and punch versions available

Dual Row MLF® Package

An MLF® package with two rows of leads offers a

cost effective, high-performance solution for devices

requiring up to 180 I/O. Typical applications include

hard disk drives, USB controllers and wireless LAN.

Saw MLF® Wettable Flanks Package

This package meets customer requirements for the

automotive industry including: fine lead pitch (0.50 mm,

0.65 mm), higher solder filled height on the side of lead

area; similar or better BLR performance than standard

design; and elimination of need for X-ray monitoring

after SMD. Amkor has released this process to High

Volume Manufacturing (HVM).

rtMLF® (Routable Molded

Leadframe) Package

The rtMLF® is an MLF® package with resin filled traces

for small form factor driven structures. This offers a

low-cost, high thermal performance device in a smaller

footprint. It has internal routing traces with limited line

width/space capability and this package adapts easily

to flip chip configurations. rtMLF® provides higher pin

count and more flexible internal trace routing with

resin filled leadframe.

Reliability Qualification

Amkor devices are assembled in optimized package

designs with proven reliable semiconductor materials.

f

Moisture sensitivity characterization: JEDEC

level 1*, 85°C/85% RH, 168 hrs

f

uHAST: 130°C/85% RH, 96 hrs

f

Temp/Humidity: 85°C/85% RH, 1000 hours

f

Temp cycle: -65°C/+150°C, 1000 cycles

f

High temp storage: 150°C, 1000 hours

*Depending on BOM, body size and design

Process Highlights

f

Die thickness: .20 ± .05 mm nominal, thinner for

special applications

f

Marking: Laser

f

IPD: Integrated passive device

f

Stacked die: Multiple die, pyramid or side by side

combination

Standard Materials

f

Leadframe: Copper alloy, dual gauge, PPF

f

Die attach: Conductive epoxy or DAF, non-conductive

epoxy or DAF

f

Wire: Au, Cu, Au PCC, Ag

f

Mold compound: Pb-free/Green capable

f

Plating: Matte Sn, NiPdAu, Ag

Test Services

f

Program generation/conversion

f

Product engineering

f

Available test/handling technology

f

Burn-in capabilities

f

Tape and reel services

f

Film frame

Shipping

f

Clear anti-static tubes, bakable trays or metal

canisters