Amkor’s MicroLeadFrame® (MLF®/QFN/SON/DFN) package is a near

CSP plastic encapsulated package with a copper leadframe substrate.

This package uses perimeter lands on the bottom of the package to

provide electrical contact to the Printed Wiring Board (PWB).

The package also offers Amkor’s ExposedPad technology as a thermal

enhancement. Having the die attach paddle exposed on the bottom

of the package surface provides an efficient heat path when soldered

directly to the PWB. This enhancement also enables stable ground

using down bonds or by electrical connection through a conductive

die attach material.

Applications

The small size and weight along with excellent thermal and electrical

performance make the MicroLeadFrame® package an ideal choice for

handheld portable applications such as smartphones and tablets or

any other application where size, weight and package performance are

required.

MicroLeadFrame®

DATA SHEET | LEADFRAME PRODUCTS

Thermal Performance

Multi-Layer PCB

Package

Body Size

(mm)

# Board

Vias

Exposed Pad

(mm)

Die

(mm)

ΘJA

(°C/W)

12 Ld

3 x 3

1

1.25

1.25

61.1

28 Ld

5 x 5

9

2.7

2.54

34.8

44 Ld

7 x 7

16

4.8

3.81

24.4

52 Ld

8 x 8

25

6.1

5.08

20.9

64 Ld

10 x 10

36

7.1

2.79

29.4

124 Ld

10 x 10

36

7.1

2.79

30.0

JEDEC standard test boards

Modeled data @ air flow

Electrical Performance

Simulated Results @ 2 GHz

Package

Body Size

(mm)

Lead

Inductance

(nH)

Capacitance

(pF)

Resistance

(mΩ)

12 Ld

3 x 3

Longest

Shortest

0.564

0.531

0.203

0.220

141.8

138.9

44 Ld

7 x 7

Longest

Shortest

1.766

1.194

0.326

0.289

315.1

234.5

64 Ld

10 x 10

Longest

Shortest

2.179

1.475

0.518

0.409

337.5

250.8

Values dependent on specific die and wire configurations

MLF® OFFERINGS

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Chip-on-Lead (CoL)

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Thin MicroLeadFrame®

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Flip chip MLF® (fcMLF®)

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Routable MLF® (rtMLF®)

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Single row (up to 108 I/O)

▷ Punch and saw formats

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Dual row (up to 180 I/O)

▷ Punch and saw formats

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Multi-Chip Package (MCP)

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Stacked die

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Non-exposed pad

f

PPF (NiPd) punch & saw

MicroLeadFrame®

f

Small MLF® (less than 2 x 2 body size)

f

Non-magnetic leadframes for sensors

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Split pad designs for increased

flexibility and I/O count

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Wettable flanks (PEL)

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Edge Protection™ technology