MicroLeadFrame®

Edge Protection™ Technology

Since its inception in the late 1990’s, Amkor’s

MicroLeadFrame® package has seen accelerated

adoption by the automotive industry as a result of its

size advantages, robust performance qualities and

the integration of wettable flanks. Amkor offers the

MLF® package in punch and saw formats to meet the

demanding needs of the automotive industry and

is recognized as the premiere supplier of this QFN

package.

To further improve the strength of the MLF® package

design, Amkor has developed Edge Protection™

technology that protects the edges of the device during

handling operations, such as test and surface mount

assembly (SMA). By strengthening the edges of the

punch MLF® package, test induced damage has been

significantly reduced. Amkor now offers its punch MLF®

package with Edge Protection™ technology in a variety

of body sizes.

This innovative enhancement is rapidly growing in

acceptance, particularly in the area of test, as Amkor’s

Edge Protection™ technology improves the robustness

of package design. Additionally, Amkor has continued

to develop enhancements to extend the capabilities of

the MLF® package. With the proven implementation of

dimple end leads, the punch MLF® continues to be the

package format of choice for automotive applications.

Edge Protection™ Considerations

Amkor’s package enhancement protects the edges of

MLF® packaging during handling, test and assembly

process operations.

Advantages

f

Package corners and edges strengthened by ≥2x

f

Elimination of test induced damage

f

Elimination of common handling damage

f

No change to package footprint

Individual Unit Design “Punch”

Cross Section MicroLeadFrame®

Package Height Comparison

Map Design “Saw”

Without Edge Protection™

With Edge Protection™

EPT

Gold wire

Cu leadframe

A

B

Down bond

Mold compound

Die

C

D

E

0.9 mm

.0.8 mm

.0.5 mm

.0.3 mm

SOT/SC

CABGA

SOIC

TSSOP

TSOP

TQFP

LQFP

TSOP

MQFP

MQFP

1.1 mm

1.2 mm

1.6 mm

2.33 mm

3.93 mm

MLF®

Die attach adhesive

Exposed die paddle

Ground bond

G

H

Ag plating

NiPd plating

J

K

A

B

C

E

D

F

I

G

H

J

F

I

B

C

E

D

F

I

G

H

K