TECHNOLOGY SOLUTIONS

Through

Silicon Via (TSV)

Through Silicon Via (TSV) interconnects serve a wide range of 2.5D

packaging applications and architectures. TSV technology allows state

of the art packages to meet high performance, low-energy demands.

Through Silicon Via (TSV)

Wafer Finishing & Flip Chip Placement

Through Silicon Via (TSV) interconnects have emerged to serve a wide

range of 2.5D TSV packaging applications and architectures that demand

very high performance and functionality at the lowest energy/performance

metric. To enable the use of TSVs in these 2.5D TSV architectures, Amkor

has developed a number of backend technology platforms for high

volume processing of TSV-bearing wafers and assembly. It is important to

distinguish that Amkor does not provide TSV formation in foundry wafers.

Amkor’s TSV wafer process begins with 300 mm wafers in which “blind”

TSVs have already been formed. Amkor’s wafer process includes thinning

the wafers to expose the TSVs and creating backside (BS) metallization to

complete the TSV interconnect structure.

The TSV reveal and BS metallization process flow is commonly referred

to as Middle-End-Of-Line (MEOL). Amkor’s MEOL production tooling and

processes include:

f

Temporary wafer support bonding and de-bonding

f

TSV wafer thinning

f

TSV “soft” reveal, wafer backside passivation and chemo-mechanical

planarization (CMP)

f

Cu redistribution as required on the interposer wafer backside

f

Lead-free plating of Cu micro-pillars or C4 backside interconnects

Amkor’s Role in 2.5D TSV Packaging With TSV

Interconnects

Amkor has enabled TSV technology solutions for the backend processing

of TSV wafers (MEOL), bumping and 2.5D TSV assemblies. This requires

advanced capability in the following key areas:

f

Wafer support bonding and de-bonding of TSV-bearing wafers

▷ Temporary Wafer Support System (WSS) for thin wafer management

f

TSV MEOL processing

▷ Bonding and de-bonding of TSV-bearing wafers

▷ Wafer thinning to 100 μm (nominal) or thinner for 2.5D TSV products

(per customer requirements)

▷ Wafer backside passivation

▷ TSV reveal process including CMP