Completed Si Interposer (w/TSVs)

2.5D TSV Reveal Processing (MEOL)

“MEOL”

TSV Reveal

TSV Wafer

Fabrication

Frontside

Bumping

Backside

Bumping

MEOL1

MEOL2

Packaging

Test

Frontside (FS): Cu/Ni/Au pad

Backside (BS): Cu RDL + organic passivation + Cu Pillar

Completed 2.5D

Structure

C

D

E

B

A

FS pad

Fab BEOL

TSV

BS Cu RDL

BS Cu pillar

A

B

C

D

E

Through Silicon Via (TSV)

Fine Pitch Micro Copper Pillar Bumping – The Backbone of TSV Assemblies and Advanced Packaging