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TSV 数据表(PDF) 4 Page - Amkor Technology

部件名 TSV
功能描述  Through Silicon Via (TSV) interconnects serve a wide range of 2.5D packaging applications and architectures.
PDF  5 Pages
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制造商  AMKOR [Amkor Technology]
网页  http://www.amkor.com
标志 AMKOR - Amkor Technology

TSV 数据表(HTML) 4 Page - Amkor Technology

  TSV Datasheet HTML 1Page - Amkor Technology TSV Datasheet HTML 2Page - Amkor Technology TSV Datasheet HTML 3Page - Amkor Technology TSV Datasheet HTML 4Page - Amkor Technology TSV Datasheet HTML 5Page - Amkor Technology  
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Chip on Wafer (CoW) Assembly Flow
2.5D CoW Assembly: Die Site Population on Wafer & Die Underfill
2.5D CoW Assembly: Wafer Overmold, Mold Backgrind and Module Thinning
Final Stage of 2.5D CoW Assembly
2.5D CoW module
Interposer
wafer
Top die 2
Top die 1
2.5D CoW module
Top die 1
Top die 2
Top die 1
Top die 2
Interposer
wafer
2.5D CoW module
Top die 1
Top die 2
Singulated
interposer
FC substrate
Top die 1
Through Silicon Via (TSV)
C
D
E
A
B
Top die
CuP interconnect
TSV
BS Cu pillar
Substrate
A
B
C
D
E



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