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TDA4AEN...Q1 数据表(PDF) 112 Page - Texas Instruments |
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TDA4AEN...Q1 数据表(HTML) 112 Page - Texas Instruments |
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112 / 236 page  6.9.4.1.1 MCU_OSC0 Internal Oscillator Clock Source Figure 6-16 shows the recommended crystal circuit. All discrete components used to implement the oscillator circuit must be placed as close as possible to the MCU_OSC0_XI and MCU_OSC0_XO pins. Device MCU_OSC0_XO MCU_OSC0_XI C L1 Crystal C L2 AM65x_MCU_OSC_INT_01 PCB Ground Figure 6-16. MCU_OSC0 Crystal Implementation The crystal must be in the fundamental mode of operation and parallel resonant. Table 6-21 summarizes the required electrical constraints. Table 6-21. MCU_OSC0 Crystal Circuit Requirements PARAMETER MIN TYP MAX UNIT Fxtal Crystal Parallel Resonance Frequency 25 MHz Fxtal Crystal Frequency Stability and Tolerance Ethernet RGMII and RMII not used ±100 ppm Ethernet RGMII and RMII using derived clock ±50 CL1+PCBXI Capacitance of CL1 + CPCBXI 12 24 pF CL2+PCBXO Capacitance of CL2 + CPCBXO 12 24 pF CL Crystal Load Capacitance 6 12 pF Cshunt Crystal Circuit Shunt Capacitance ESRxtal = 30Ω 25MHz 7 pF ESRxtal = 40Ω 25MHz 5 pF ESRxtal = 50Ω 25MHz 5 pF ESRxtal Crystal Effective Series Resistance (1) Ω (1) The maximum ESR of the crystal is a function of the crystal frequency and shunt capacitance. See the Cshunt parameter. When selecting a crystal, the system design must consider temperature and aging characteristics of the crystal based on worst case environment and expected life expectancy of the system. Table 6-22 details the switching characteristics of the oscillator. Table 6-22. MCU_OSC0 Switching Characteristics - Crystal Mode PARAMETER MIN TYP MAX UNIT CXI XI Capacitance 2.04 pF CXO XO Capacitance 1.91 pF CXIXO XI to XO Mutual Capacitance 0.01 pF TDA4VEN-Q1, TDA4AEN-Q1 SPRSP96A – MARCH 2024 – REVISED SEPTEMBER 2024 www.ti.com 112 Submit Document Feedback Copyright © 2024 Texas Instruments Incorporated Product Folder Links: TDA4VEN-Q1 TDA4AEN-Q1 |
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