20

 2007 Semtech Corp.

www.semtech.com

POWER MANAGEMENT

SC4624

Outline Drawing - SO-16 EDP

Land Pattern - SO-16 EDP

THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR

COMPANY'S MANUFACTURING GUIDELINES ARE MET.

NOTES:

1.

REFERENCE IPC-SM-782A, RLP NO. 300A.

2.

INCHES

DIMENSIONS

Z

P

Y

X

DIM

C

F

MILLIMETERS

.094

2.40

3.

THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD

SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.

FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR

FUNCTIONAL PERFORMANCE OF THE DEVICE.

(C)

P

X

G

Y

Z

F

D

(.205)

(5.20)

1.27

.050

0.60

.024

2.20

.087

7.40

.291

E

SOLDER MASK

THERMAL VIA

Ø 0.36mm

D

2.90

.114

E

.201

5.10

G

.118

3.00

Semtech Corporation

Power Management Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111 Fax: (805) 498-3804

Contact Information

www.semtech.com

1

2

N

e

A

2X

E/2

E1

E

D

ccc C

2X N/2 TIPS

e/2

B

F

DIM

c

e

h

L

E1

E

D

A1

A2

b

A

ccc

aaa

bbb

01

N

L1

DATUMS

AND

TO BE DETERMINED AT DATUM PLANE

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS

PLANE

GAUGE

0.25

SEE DETAIL

REFERENCE JEDEC STD MS-012, VARIATION AC.

OR GATE BURRS.

4.

3.

NOTES:

2.

1.

-A-

-B-

SIDE VIEW

0.10

.004

-H-

01

(L1)

L

DETAIL

A

A

.008

.010

H

c

0.20

0.25

MILLIMETERS

MIN

6.00 BSC

1.27 BSC

.005

0.00

.000

-

.105

.028

(.041)

.390

.154

.236 BSC

.050 BSC

.100

.010

.016

0°

16

-

-

.049

.007

.012

.386

.150

-

-

-

.110

.020

.041

8°

0.40

0°

2.54

0.25

.065

.010

.020

.394

.157

9.80

3.80

1.25

0.17

0.31

INCHES

DIMENSIONS

NOM

MIN

.053

-

MAX

.069

1.35

0.13

-

(1.04)

0.72

16

-

2.67

-

1.04

8°

2.79

0.50

9.90

3.90

-

-

-

10.00

4.00

1.65

0.25

0.51

MAX

NOM

-

1.75

PLANE

SEATING

C

aaa C

A

A1

A2

bbb

C A-B D

D

bxN

EXPOSED PAD

F

H

h

h

H

.080

.085

.090

2.03

2.16

2.29

3