DSILC6-4xx

Package information

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Figure 13.

Flip-Chip Dimensions

Figure 16.

Flip-Chip tape and reel specifications

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available

at: www.st.com.

Figure 14.

Flip-Chip footprint

Figure 15.

Flip-Chip marking

1.1 mm ± 50 µm

315 µm ± 50

500 µm ± 50

650 µm ± 65

Copper pad Diameter :

220µm recommended

Solder stencil opening :

330µm recommended

Solder mask opening recommendation :

300µm recommended

x

y

x

w

z

w

E

Dot, ST logo

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 +/- 0.1

4 +/- 0.1

Ø 1.5 +/- 0.1

0.73 +/- 0.05