CPM3-3300-R050A

6

Rev. 02, 09-2024

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The information in this document is subject to change without notice.

Product Dimensions CPM3-3300-R050A

Die Dimensions (mm)

Not Drawn to Scale

Mechanical Dimensions CPM3-3300-R050A

Parameter

Typical

Unit

Die Size (L × W)

4.90  7.70

mm

Exposed Source Pad Metal Dimensions

1.83  6.68 ( 2)

mm

Gate Pad Dimensions

0.6  1.3

mm

Chip Thickness1

400 ± 40

µm

Frontside (Source) Metallization (Al)

4

µm

Frontside (Gate) Metallization (Al)

4

µm

Backside (Drain) Metallization (Ni/Au)

0.8 / 0.1

µm

1 SiC wafer thickness