Data Sheet

ADRF5031

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 5 of 12

For the recommended operating conditions, see Table 1.

Table 3. Absolute Maximum Ratings

Parameter

Rating

Positive Supply Voltage

−0.3 V to +3.6 V

Negative Supply Voltage

−3.6 V to +0.3 V

Digital Control Input1

Voltage

−0.3 V to VDD + 0.3 V

Current

3 mA

RF Input Power, Dual Supply2 (VDD = 3.3 V, VSS =

−3.3 V, f = 1 MHz to 20 GHz, TCASE = 85°C3)

Through Path

Average

34 dBm

Peak

36 dBm

Terminated Path

Average

30.5 dBm

Peak

32.5 dBm

Hot Switching (RFC)

Average

33.5 dBm

Peak

35.5 dBm

Hot Switching (RFx)

Average

30.5 dBm

Peak

32.5 dBm

RF Input Power, Single Supply (VDD = 3.3 V, VSS

= 0 V, f = 1 MHz to 20 GHz, TCASE = 85°C)

Through Path

25 dBm

Terminated Path

25 dBm

Hot Switching (RFC)

25 dBm

RF Input Power, Unbiased (VDD, VSS = 0 V)

Average

31 dBm

Peak4

36 dBm

Temperature

Junction, TJ

135°C

Storage Range

−65°C to +150°C

Reflow

260°C

1 Overvoltages at the digital control input are clamped by internal diodes.

Current must be limited to the maximum rating given.

2 For power derating over frequency, see Figure 2.

3 For 105°C operation, the power handling degrades from the TCASE = 85°C

specification by 3 dB for dual supply.

4 Peak: (≤100 ns pulse duration, 5% duty cycle).

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

Only one absolute maximum rating can be applied at any one time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction-to-case bottom (channel-to-package bottom)

thermal resistance.

Table 4. Thermal Resistance

Package Type

θJC1

Unit

CC-20-21

Through Path

110

°C/W

Terminated Path

50

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to the thermal conduction from the channel through the

ground pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVE

Figure 2. Power Derating vs. Frequency, Low-Frequency Detail, TCASE = 85°C