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STRH50P6FSY1 数据表(PDF) 6 Page - STMicroelectronics |
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STRH50P6FSY1 数据表(HTML) 6 Page - STMicroelectronics |
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6 / 13 page ![]() Electrical characteristics STRH50P6FSY3 6/13 Figure 2. Bias condition during radiation Table 10. Single event effect, SOA(1) 1. Rad-Hard Power MOSFETs have been characterized in heavy ion environment for single event effect (SEE). Single event effect characterization is illustrated Ion Let (Mev/(mg/cm2)) Energy (MeV) Range (µm) VDS (V) @VGS0V Kr 34 316 43 60 Xe 55.9 459 43 48 Table 11. Source drain diode Symbol Parameter Test conditions Min. Typ. Max Unit ISD ISDM (1) 1. Pulse width limited by safe operating area Source-drain current Source-drain current (pulsed) 50 200 A A VSD (2) 2. Pulsed: pulse duration = 300µs, duty cycle 1.5% Forward on voltage ISD = 50 A, VGS = 0 1.1 V trr Qrr IRRM Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 50 A, di/dt = 100 A/µs VDD= 20 V, Tj = 25°C 240 300 3.85 25.6 360 ns µC A trr Qrr IRRM Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 50 A, di/dt = 100 A/µs VDD= 20 V, Tj = 150°C 300 376 5.64 30 451 ns µC A |
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