Data Sheet

ADRF5051

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 6 of 18

For recommended operating conditions, see Table 1 and Table 2.

Table 3. Absolute Maximum Ratings

Parameter

Rating

Supply Voltage

VDD

−0.3V to +3.6V

VSS

−3.6V to +0.3V

Digital Control Inputs1

Voltage

−0.3V to VDD + 0.3V

Current

3mA

RF Input Power2

Dual Supply (VDD = 3.3V, VSS = −3.3V, f =

1MHz to 20GHz, TCASE = 85°C3)

Through Path

33.5dBm

Terminated Path

18.5dBm

Hot Switching (RFC)

30.5dBm

Hot Switching (RFx)

18.5dBm

Single Supply (VDD = 3.3V, VSS = 0V, f =

1MHz to 20GHz, TCASE = 85°C3)

Through Path

21.5dBm

Terminated Path

18.5dBm

Hot Switching (RFC)

21.5dBm

Hot Switching (RFx)

18.5dBm

Unbiased (VDD = 0V, VSS = 0V)

RFC

30dBm

RFx

27dBm

Temperature

Junction, TJ

135°C

Storage Range

−65°C to +150°C

Reflow

260°C

1 Overvoltages at the digital control inputs are clamped by internal diodes.

Current must be limited to the maximum rating given.

2 For RF power handling derating over the extended frequency range, see

Figure 2.

3 For TCASE = 105°C operation, the RF power handling derates from the TCASE =

85°C specification by 3dB.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required. θJC is the junction to case bottom

(channel to package bottom) thermal resistance.

Table 4. Thermal Resistance

Package Type

θJC1

Unit

CC-24-16

Through Path

110

°C/W

Terminated Path

800

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel through the

round pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVE

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C