ST7262 datasheet(124/139 Pages) STMICROELECTRONICS

部件名	ST7262

功能描述	LOW SPEED USB 8-BIT MCU WITH 3 ENDPOINTS, FLASH OR ROM MEMORY, LVD, WDG, 10-BIT ADC, 2 TIMERS, SCI, SPI

PDF	139 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

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13 PACKAGE CHARACTERISTICS

In order to meet environmental requirements, ST

offers these devices in ECOPACK® packages.

These packages have a Lead-free second level in-

terconnect. The category of second Level Inter-

connect is marked on the package and on the in-

ner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to solder-

ing conditions are also marked on the inner box la-

bel.

ECOPACK is an ST trademark. ECOPACK speci-

fications are available at: www.st.com

13.1 PACKAGE MECHANICAL DATA

Figure 86. 44-Pin Low Profile Quad Flat Package

Dim.

inches1)

Min

Typ

Max

Min

Typ

Max

1.60

0.063

0.05

0.15 0.002

0.006

1.35

1.40

1.45 0.053 0.055 0.057

0.30

0.37

0.45 0.012 0.015 0.018

0.09

0.20 0.004 0.000 0.008

12.00

0.472

10.00

0.394

12.00

0.472

10.00

0.394

0.80

0.031

0°

3.5°

7°

0°

3.5°

7°

0.45

0.60

0.75 0.018 0.024 0.030

1.00

0.039

Number of Pins

Note 1. Values in inches are converted from

mm and rounded to 3 decimal digits.

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