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BQ78350-R1 数据表(PDF) 22 Page - Texas Instruments |
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BQ78350-R1 数据表(HTML) 22 Page - Texas Instruments |
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22 / 31 page ![]() VCC bq78350 C22 C21 RBI 22 bq78350-R1 SLUSCD0B – AUGUST 2015 – REVISED NOVEMBER 2018 www.ti.com Product Folder Links: bq78350-R1 Submit Documentation Feedback Copyright © 2015–2018, Texas Instruments Incorporated Layout Guidelines (continued) 11.1.3 Communication Line Protection Components The 5.6-V Zener diodes, which protect the bq78350-R1 communication pins from ESD, must be located as close as possible to the pack connector. The grounded end of these Zener diodes must be returned to the PACK(–) node, rather than to the low-current digital ground system. This way, ESD is diverted away from the sensitive electronics as much as possible. 11.1.4 ESD Spark Gap Protect the SMBus clock, data, and other communication lines from ESD with a spark gap at the connector. The following pattern is recommended, with 0.2-mm spacing between the points. Figure 15. Recommended Spark-Gap Pattern Helps Protect Communication Lines From ESD 11.2 Layout Example Figure 16. bq78350-R1 Layout |
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