2.3

Thermal data

Table 3. Thermal data

Symbol

Parameter

Conditions

Value

Unit

RthJA

Junction-to-ambient thermal

resistance

Natural convection, according to JESD51-2a (1)

94.5

°C/W

RthJCtop

Junction-to-case thermal

resistance (top side)

Cold plate on top, according to JESD51-12 (1)

28.4

°C/W

RthJCbot

Junction-to-case thermal

resistance (bottom side)

Cold plate on exposed pad, according to JESD51-12(1)

1.47

°C/W

RthJB

Junction-to-board thermal

resistance

According to JESD51-8(1)

14.4

°C/W

ΨJT

Junction-to-top

characterization parameter

According to JESD51-2a(1)

0.6

°C/W

ΨJB

Junction-to-board

characterization parameter

According to JESD51-2a(1)

14.2

°C/W

1. Simulated on a 21.2x21.2 mm board, 2s2p 1 Oz copper and four 300 µm vias below exposed pad.

2.4

Electrical sensitivity characteristics

Table 4. ESD protection ratings

Symbol

Parameter

Test Condition

Class

Value

Unit

HBM

Human Body Model

Conforming to ANSI/ESDA/JEDEC JS-001-2017

H2

2

kV

CDM

Charge Device Model

Conforming to ANSI/ESDA/JEDEC JS-002-2014

C2B

750

V

STDRIVE101

Thermal data

DS13472 - Rev 1

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