ADS7828

2

SBAS181C

www.ti.com

MAXIMUM

INTEGRAL

SPECIFIED

LINEARITY

PACKAGE

TEMPERATURE

ORDERING

TRANSPORT

PRODUCT

ERROR (LSB)

PACKAGE-LEAD

DESIGNATOR

RANGE

NUMBER

MEDIA, QUANTITY

ADS7828E

±2

TSSOP-16

PW

–40

°C to +85°C

ADS7828E/250

Tape and Reel, 250

""

"

"

"

ADS7828E/2K5

Tape and Reel, 2500

ADS7828EB

±1

TSSOP-16

PW

–40

°C to +85°C

ADS7828EB/250

Tape and Reel, 250

""

"

"

"

ADS7828EB/2K5

Tape and Reel, 2500

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at www.ti.com.

PACKAGE/ORDERING INFORMATION(1)

ABSOLUTE MAXIMUM RATINGS(1)

+VDD to GND ........................................................................ –0.3V to +6V

Digital Input Voltage to GND ................................. –0.3V to +VDD + 0.3V

Operating Temperature Range ...................................... –40

°C to +105°C

Storage Temperature Range ......................................... –65

°C to +150°C

Junction Temperature (TJ max) .................................................... +150°C

TSSOP Package

Power Dissipation .................................................... (TJ max – TA)/θJA

θ

JA Thermal Impedance ........................................................ 240°C/W

Lead Temperature, Soldering

Vapor Phase (60s) ............................................................ +215

°C

Infrared (15s) ..................................................................... +220

°C

NOTE: (1) Stresses above those listed under

Absolute Maximum Ratings may

cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper han-

dling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

PIN CONFIGURATION

Top View

TSSOP

PIN DESCRIPTIONS

PIN

NAME

DESCRIPTION

1

CH0

Analog Input Channel 0

2

CH1

Analog Input Channel 1

3

CH2

Analog Input Channel 2

4

CH3

Analog Input Channel 3

5

CH4

Analog Input Channel 4

6

CH5

Analog Input Channel 5

7

CH6

Analog Input Channel 6

8

CH7

Analog Input Channel 7

9

GND

Analog Ground

10

REFIN / REFOUT Internal +2.5V Reference, External Reference Input

11

COM

Common to Analog Input Channel

12

A0

Slave Address Bit 0

13

A1

Slave Address Bit 1

14

SCL

Serial Clock

15

SDA

Serial Data

16

+VDD

Power Supply, 3.3V Nominal

1

2

3

4

5

6

7

8

CH0

CH1

CH2

CH3

CH4

CH5

CH6

CH7

+V

DD

SDA

SCL

A1

A0

COM

REF

IN / REFOUT

GND

16

15

14

13

12

11

10

9

ADS7828