DocID07617 Rev 4

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L6206

Maximum ratings

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Table 3. Thermal data

Symbol

Description

SO24

PowerSO36

Unit

Rth-j-pins

Maximum thermal resistance junction pins

14

-

C/W

Rth-j-case Maximum thermal resistance junction case

-

1

C/W

Rth-j-amb1 Maximum thermal resistance junction ambient(1)

1. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm2

(with a thickness of 35 µm).

51

-

C/W

Rth-j-amb1 Maximum thermal resistance junction ambient(2)

2. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm2

(with a thickness of 35 µm).

-35

C/W

Rth-j-amb1 Maximum thermal resistance junction ambient(3)

3. Mounted on a multilayer FR4 PCB with a dissipating copper surface on the top side of 6 cm2

(with a thickness of 35 µm), 16 via holes and a ground layer.

-15

C/W

Rth-j-amb2 Maximum thermal resistance junction ambient(4)

4. Mounted on a multilayer FR4 PCB without any heatsinking surface on the board.

77

62

C/W