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L6206PD 数据表(PDF) 21 Page - STMicroelectronics |
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L6206PD 数据表(HTML) 21 Page - STMicroelectronics |
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21 / 29 page ![]() DocID07617 Rev 4 21/29 L6206 Application information 29 6.2 Output current capability and IC power dissipation In Figure 18 and Figure 19 are shown the approximate relation between the output current and the IC power dissipation using PWM current control driving two loads, for two different driving types: One full bridge ON at a time (Figure 18) in which only one load at a time is energized. Two full bridges ON at the same time (Figure 19) in which two loads at the same time are energized. For a given output current and driving type the power dissipated by the IC can be easily evaluated, in order to establish which package should be used and how large must be the on-board copper dissipating area to guarantee a safe operating junction temperature (125 °C maximum). Figure 18. IC power dissipation versus output current with one full bridge ON at a time Figure 19. IC power dissipation versus output current with two full bridges ON at the same time |
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