STM1831

Maximum ratings

Doc ID 18180 Rev 1

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Maximum ratings

Stressing the device above the ratings listed in Table 2 may cause permanent damage to

the device. These are stress ratings only and operation of the device at these or any other

conditions above those indicated in the operating sections of this specification is not implied.

Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Table 2.

Absolute maximum ratings

Symbol

Parameter

Value

Unit

TSTG

Storage temperature (VCC off)

–55 to 150

°C

TSLD

(1)

1.

Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.

Lead solder temperature for 10 seconds

260

°C

TJ

Maximum junction temperature

125

°C

VCC

Supply voltage

–0.3 to 7.0

V

VCD

Delay capacitor pin voltage

–0.3 to VCC + 0.3

V

VRST

Reset output voltage

– N-channel open drain

–0.3 to 7.0

V

VESD

ESD voltage

– Human body model (MIL-STD-883, Method 3015)

– Machine model

2000

200

V