5.4 Thermal Information

THERMAL METRIC(1)

LSF0002

UNIT

DTQ (X2SON)

6 PINS

RθJA

Junction-to-ambient thermal resistance

294.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

188.9

°C/W

RθJB

Junction-to-board thermal resistance

216.8

°C/W

ΨJT

Junction-to-top characterization parameter

26.5

°C/W

ΨJB

Junction-to-board characterization parameter

216.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP(1)

MAX

UNIT

VIK

II = -18mA

EN = 0V

-1.2

V

IIH

VI = 5V

EN = 0V

5.0

µA

ICCBA

Vref_B = VEN = 5.5V, Vref_A = 4.5V, IO = 0, VI = VCC or GND

1

µA

CI(ref_A/B/EN)

VI = 3V or 0

11

pF

Cio(off)

VO = 3V or 0,

VEN = 0V

4.0

6.0

pF

Cio(on)

VO = 3V or 0,

VEN = 3V

10.5

12.5

pF

rON (2)

VI = 0,

IO = 64mA

Vref_A = 3.3V; Vref_B = VEN =

5V

8.0

Ω

Vref_A = 1.8V; Vref_B = VEN =

5V

9.0

Vref_A = 1.0V; Vref_B = VEN =

5V

10

VI = 0,

IO = 32mA

Vref_A = 1.8V; Vref_B = VEN =

5V

10

Ω

Vref_A = 2.5V; Vref_B = VEN =

5V

15

VI = 1.8V,

IO = 15mA

Vref_A = 3.3V; Vref_B = VEN =

5V

9.0

Ω

VI = 1.0V,

IO = 10mA

Vref_A = 1.8V; Vref_B = VEN =

3.3V

18

Ω

VI = 0V,

IO = 10mA

Vref_A = 1.0V; Vref_B = VEN =

3.3V

20

Ω

VI = 0V,

IO = 10mA

Vref_A = 1.0V; Vref_B = VEN =

1.8V

30

Ω

(1)

All typical values are at TA = 25°C.

(2)

Measured by the voltage drop between the A and B pins at the indicated current through the switch. Minimum ON-state resistance is

determined by the lowest voltage of the two (A or B) pins.

LSF0002

SDLS975 – APRIL 2024

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