STMPE1601 datasheet(55/58 Pages) STMICROELECTRONICS

部件名	STMPE1601

功能描述	16-bit enhanced port expander with keypad and PWM controller Xpander Logic

PDF	58 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

55 / 58 page

STMPE1601

Package mechanical data

55/58

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com

Figure 11. TFBGA25 package outline

Table 23.

TFBGA25 mechanical data

Dim.

mm.

inch

Min

Typ

Max

Min

Typ

Max

1.0

1.1

1.16

39.4

43.3

45.7

0.25

9.8

0.78

0.86

30.7

33.9

0.25

0.30

0.35

9.8

11.8

13.8

2.9

3.0

3.1

114.2

118.1

122.0

78.8

2.9

3.0

3.1

114.2

118.1

122.0

78.8

0.5

19.7

0.25

9.8

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