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VNQ830 数据表(PDF) 8 Page - STMicroelectronics |
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VNQ830 数据表(HTML) 8 Page - STMicroelectronics |
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8 / 28 page ![]() Electrical specifications VNQ830 8/28 Doc ID 7390 Rev 5 2.2 Thermal data 2.3 Electrical characteristics Values specified in this section are for 8V < VCC < 36V; -40 °C < Tj < 150 °C, unless otherwise stated. Figure 3. Current and voltage conventions Note: VFn = VCCn - VOUTn during reverse battery condition. Table 4. Thermal data (per island) Symbol Parameter Value Unit Rthj-lead Thermal resistance junction-lead 20 °C/W Rthj-amb Thermal resistance junction-ambient (one chip ON) 60(1) 1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. 44(2) 2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 µm thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. °C/W Rthj-amb Thermal resistance junction-ambient (two chips ON) 46(1) 31(2) °C/W IS1,2 IGND1,2 OUTPUT3 VCC1,2 GND1,2 INPUT2 IOUT3 VCC1,2 VOUT4 OUTPUT2 IOUT2 VOUT3 INPUT1 IIN1 STATUS1 ISTAT1 OUTPUT1 IOUT1 OUTPUT4 IOUT4 VOUT2 VOUT1 IIN2 ISTAT2 ISTAT3 IIN4 ISTAT4 STATUS2 STATUS3 STATUS4 INPUT3 INPUT4 VSTAT4 VIN4 VSTAT3 VIN3 VSTAT2 IIN3 VIN2 VSTAT1 VIN1 IGND3,4 GND3,4 IS3,4 VCC3,4 VCC3,4 VF1 (*) Obsolete Product(s) - Obsolete Product(s) |
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