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VNQ830 数据表(PDF) 23 Page - STMicroelectronics |
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VNQ830 数据表(HTML) 23 Page - STMicroelectronics |
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23 / 28 page ![]() VNQ830 Package and PCB thermal data Doc ID 7390 Rev 5 23/28 Figure 28. Rthj-amb vs PCB copper area in open box free air condition Figure 29. Thermal impedance junction ambient single pulse 10 20 30 40 50 60 70 0 1 23 45 6 7 PCB Cu heatsink area (cm ^2)/island RTHj_am b (°C/W) RthA RthB RthC Footprint 6 cm 2 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 Time (s) ZTH (°C/W) Obsolete Product(s) - Obsolete Product(s) |
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