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VNQ830 数据表(PDF) 22 Page - STMicroelectronics |
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VNQ830 数据表(HTML) 22 Page - STMicroelectronics |
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22 / 28 page ![]() Package and PCB thermal data VNQ830 22/28 Doc ID 7390 Rev 5 4 Package and PCB thermal data 4.1 SO-28 thermal data Figure 27. SO-28 PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB thickness = 2mm, Cu thickness = 35µm, Copper areas: 0.5 cm2, 3 cm2, 6 cm2). RthA = thermal resistance junction to ambient with one chip ON RthB = thermal resistance junction to ambient with both chips ON and Pdchip1 = Pdchip2 RthC = mutual thermal resistance Table 16. Thermal calculation according to the PCB heatsink area Chip 1 Chip 2 Tjchip1 Tjchip2 Note ON OFF RthA x Pdchip1 + Tamb RthC x Pdchip1 + Tamb OFF ON RthC x Pdchip2 + Tamb RthA x Pdchip2 + Tamb ON ON RthB x (Pdchip1 + Pdchip2) + Tamb RthB x (Pdchip1 + Pdchip2) + Tamb Pdchip1 = Pdchip2 ON ON (RthA x Pdchip1) + RthC x Pdchip2 + Tamb (RthA x Pdchip2) + RthC x Pdchip1 + Tamb Pdchip1 ≠ Pdchip2 Obsolete Product(s) - Obsolete Product(s) |
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